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IBM designed custom hybrid circuits using flip-chip mounted, glass encapsulated transistors and diodes with silk screened resistors on a 0.5" ceramic substrate. The placement of the devices was accomplished by automatic placement machines. The produced circuits were either encapsulated in plastic or covered with a metal lid. Several of these hybrid circuits were then with other devices mounted on a small multi-layer printed circuit board to make an SLT module. There were modules with 6, 12 and 24 hybrid circuits on it. Each SLT module had a socket on one edge that was plugged into a SLT-Board.
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